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Steady-state cracking in brittle substrates beneath adherent filmsby: Zhigang Suo, John W Hutchinson
International Journal of Solids and Structures, Vol. 25, No. 11. (1989), pp. 1337-1353.
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AbstractA crack in a brittle substrate parallel to the film/substrate interface is considered. Stress intensity factors are obtained as a function of fiim, substrate thickness, elastic properties and edge loads at arbitrary crack depth. These results, combined with the criterion K11 = 0. are used to predict the steady-state cracking depth. The critical combination of residual stress and film thickness below which steady-state substrate cracking is avoided can be inferred provided the substrate toughness is known.
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